Chip-on-board printed circuit assembly using aluminum wire bonded to copper pads

摘要

A printed circuit board carries a microcircuit package electrically connected to bare copper connector pads on the printed circuit board microcircuit package by aluminum wires. The copper connection pads are encapsulated by a material such as low stress liquid encapsulant having a thermal expansion coefficient approximately equal to that of the printed circuit board substrate material. Preferably the printed circuit board laminate comprises cellulose epoxy mat such as CEM-1.