发明名称 COATED SOLDER MATERIAL AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To provide a solder material and its manufacturing method capable of restraining deterioration with age i.e., restraining the reduction of a wet expansional property, lubricity and a joinability even when the time period just after manufacture until usage becomes long. SOLUTION: Extruding and wire drawing are applied to the ingot composed of, by wt., 63%, Sn-37%. Pb to obtain the solder wire of 100μm in diameter as the solder material. The solder wire is made to pass so that it is immersed into the solution dissolved the fluoroalkyl group containing phosphate ester compound of 0.1g and the nonionic surface active agent of 1.0g into ethanol 1.0L at the room temperature for two seconds, thereafter it is dried, whereby the coated solder wire coated a phosphorus containing substance and the nonionic surface agent is manufactured.
申请公布号 JPH10166177(A) 申请公布日期 1998.06.23
申请号 JP19960329666 申请日期 1996.12.10
申请人 TANAKA DENSHI KOGYO KK 发明人 YANAGIDA MASARU;KOGASHIWA TOSHINORI;ARIKAWA TAKATOSHI
分类号 B23K35/14;B23K35/40;H01L21/60;(IPC1-7):B23K35/14 主分类号 B23K35/14
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