| 摘要 |
A method of producing a semiconductor chip on a chip carrier includes preparing a semiconductor chip having opposite front and rear surfaces and an active element on the front surface, applying solder to the rear surface of the semiconductor chip to a prescribed thickness, picking up the semiconductor chip with a collet with the rear surface facing away from the collet and exposing the solder layer to a reducing atmosphere to remove an oxide film on the surface of the solder layer, adhering the semiconductor chip to a chip carrier via the solder layer by applying heat and by applying pressure to the semiconductor chip with the collet, and cooling the chip carrier to room temperature while pressing the semiconductor chip against the chip carrier.
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