METHOD OF OBTAINING A HEAT-CONDUCTING STRUCTURE, IN PARTICULAR THAT OF AN ELECTRONIC SUB-ASSEMBLY AND-CONDUCTING ELECTRONIC SUB-ASSEMBLY AS SUCH

摘要

An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling.