COPPER PLATING ELECTROLYTE

摘要

FIELD: electrodeposition. SUBSTANCE: invention is related specifically to deposition of electrolytic compact smooth and glittering or dull coats of copper or its alloys and to manufacture of galvanoplastic articles. Copper plating electrolyte includes copper nitrate 24.2-96.8 g and dimethylsulphoxide up to 1.0 l. High-quality coats of pure copper with current output up to 98.1 per cent are deposited from proposed plating electrolyte at current densities of 0.2-0.5 A/sq.dm at temperatures of 15-45 C. EFFECT: improved quality of plating. 1 tbl