A filling squeegee (10) and a scraping squeegee (14a,14b) are provided. The filling squeegee (10) is moved in a state without contact with a surface of a mask (3) thereby to fill a solder paste (7) in openings of the mask (3), then the unnecessary solder paste (7) on the surface of the mask (3) is scraped by the scraping squeegee (14a). The solder paste (7) is prevented from being filled in the openings improperly or scraped improperly even if a speed of the squeegee is increased, so that the solder paste (7) is printed stably on circuit boards (5). <IMAGE>
