Three-dimensional electrical interconnection system

摘要

A molded electrical interconnection system (1) includes a three-dimensional molded dielectric substrate (3) including at least one open socket (4). Stamped and formed electrical circuitry (2) is embedded in the molded substrate (3) and includes a contact blade (2b,2c) projecting into the socket (4). An interface module (5) is positioned in the socket (4) to define a receptacle for receiving a male terminal (19) of a complementary connecting device.