| 发明名称 |
Electroless gold plating bath |
| 摘要 |
<p>To an electroless gold plating bath comprising a water-soluble gold compound, a complexing agent, and a reducing agent is added a non-ionic surfactant or non-ionic polymer as a stabilizer. The bath allows a satisfactory gold plating film to be formed on metal portions on a ceramic substrate as in ceramic IC package without plating spread.</p> |
| 申请公布号 |
EP0618308(B1) |
申请公布日期 |
1998.06.17 |
| 申请号 |
EP19940302159 |
申请日期 |
1994.03.25 |
| 申请人 |
C. UYEMURA & CO, LTD |
发明人 |
TSUJIMOTO, MASANOBU;MORIMOTO, KEIZIN;YANADA, ISAMU;MURAKAMI, TOORU |
| 分类号 |
C23C18/44;H01L23/12;H01L23/50;H05K3/24;(IPC1-7):C23C18/44 |
主分类号 |
C23C18/44 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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