发明名称 |
COOLING ELEMENT FOR ELECTRONIC COMPONENTS |
摘要 |
PCT No. PCT/DE96/01469 Sec. 371 Date Feb. 27, 1998 Sec. 102(e) Date Feb. 27, 1998 PCT Filed Aug. 6, 1996 PCT Pub. No. WO97/08750 PCT Pub. Date Mar. 6, 1997A heat sink for electronic components is presented, which is integral and comprises a strip of sheet brass. This strip is bent in a meandering shape, contact surfaces being seated on a heat distributor of a component, in the region of lower meandering curves. The heat sink is held firmly on the component by means of an internally produced prestress in conjunction with a snap-action connection. Although the heat sink has longitudinal elasticity even in the fitted state, its heat-dissipating function can always be maintained. |
申请公布号 |
EP0847595(A1) |
申请公布日期 |
1998.06.17 |
申请号 |
EP19960934338 |
申请日期 |
1996.08.06 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
KOHLER, GERD;KIRMSE, TOBIAS;KOEHLER, KLAUS-WERNER;LUCKNER, HANS-UWE |
分类号 |
H01L23/40;(IPC1-7):H01L23/40 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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