发明名称 COOLING ELEMENT FOR ELECTRONIC COMPONENTS
摘要 PCT No. PCT/DE96/01469 Sec. 371 Date Feb. 27, 1998 Sec. 102(e) Date Feb. 27, 1998 PCT Filed Aug. 6, 1996 PCT Pub. No. WO97/08750 PCT Pub. Date Mar. 6, 1997A heat sink for electronic components is presented, which is integral and comprises a strip of sheet brass. This strip is bent in a meandering shape, contact surfaces being seated on a heat distributor of a component, in the region of lower meandering curves. The heat sink is held firmly on the component by means of an internally produced prestress in conjunction with a snap-action connection. Although the heat sink has longitudinal elasticity even in the fitted state, its heat-dissipating function can always be maintained.
申请公布号 EP0847595(A1) 申请公布日期 1998.06.17
申请号 EP19960934338 申请日期 1996.08.06
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 KOHLER, GERD;KIRMSE, TOBIAS;KOEHLER, KLAUS-WERNER;LUCKNER, HANS-UWE
分类号 H01L23/40;(IPC1-7):H01L23/40 主分类号 H01L23/40
代理机构 代理人
主权项
地址