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发明名称
GRINDING DEVICE FOR WAFER BACK SURFACE AND GRINDING METHOD FOR WAFER BACK SURFACE
摘要
申请公布号
JPH10156679(A)
申请公布日期
1998.06.16
申请号
JP19960322474
申请日期
1996.12.03
申请人
SONY CORP
发明人
NOBE YOSHIFUMI
分类号
B24B7/04;B24B1/00;H01L21/304;(IPC1-7):B24B7/04
主分类号
B24B7/04
代理机构
代理人
主权项
地址
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