METHOD AND DEVICE FOR ELIMINATING SEMICONDUCTOR WAFER FROM FLAT SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To take out semiconductor wafers without damaging them by press- feeding liquid to the semiconductor wafers through a substrate, and separating the semiconductor wafers from the substrate by the action of this liquid to take up the semiconductor wafers by a take-up device at the time of eliminating the semiconductor wafers from the flat substrate (abrasive cloth or the like). SOLUTION: A plurality of toothed wafer carriers 3 each of which has a plurality of holes 4 formed to accommodate semiconductor wafers 5 are disposed on a polishing plate 2 covered with abrasive cloth 1. A tooth part formed at the periphery of each carrier 3 is meshed with inner and outer toothed rings 6, 7 to make each carrier 3 revolve while rotating on its axis. A plurality of liquid conductive holes 10 are formed in the polishing plate 2 so as to communicate with each outlet opening part 11 of the abrasive cloth 1. A circle 13 where one passage of each outlet opening part 11 is positioned, and each small circular track 9 corresponding to the movement of the center point of each semiconductor wafer 5 of the carrier 3 are made coincide with each other. The semiconductor wafers 5 can thereby be separated from the polishing plate 2 due to fluid pressure by feeding liquid so as to be taken up easily afterward.