| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate collecting device which can cope with a trouble such as a failure of collection of a substrate into a magazine because of a collision of the substrate against a magazine inlet during collection of the Substrate, on which wire bonding or die bonding is carried out, into the magazine. SOLUTION: A substrate 1 is fed onto a conveyor 31 by means of a conveying claw 26 so as to be fed into a magazine 12 by means of the belt conveyor 31. In this process, the substrate 1 on the belt conveyor 31 is detected by means of a substrate detecting means 34. If the tip of the substrate 1 is fed in the magazine 12 without any problem, the substrate 1 is completely fed into the magazine 12 by means of a pushing claw 36. When the substrate detecting means 34 detects that the substrate 1 collides against the inlet of the magazine 12 and is stopped on the belt conveyor 31 for a predetermined time, an informing means is driven so as to inform the fact to an operator. |
