Multi-die encapsulation device

摘要

Disclosed is an encapsulation device for bare die. The encapsulation device includes chambers having parallet walls, an insertion void, and a spring retention electrical contact having a compliant foot and comprises a cap having a compression pad. The encapsulation device of the invention provides a reliable contact between the die and a mounting board via the compliant foot. The insertion void allows for a safe insertion of a die into a chamber of the encapsulation device. The compression pad and the spring retention electrical contact provide positive retainment of the bare die within the encapsulation device.