发明名称 POLISHING METHOD AND POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a polishing method and a polishing device capable of realizing the high surface roughness and high-precise center thickness without any skill of an operator even if the relative positional relationship between a workpiece and a polishing tool is changed. SOLUTION: In a polishing method for polishing a workpiece 4 by rotating a polishing tool 12 after bringing a workpiece surface 4a of the workpiece 4 in contact with a polishing surface 12a of the polishing tool 12 and by relatively oscillating the workpiece 4 and the polishing tool 12, the relative positional relationship between the center axis Lb of the workpiece 4 and the rotational axis La of the polishing tool 4 in oscillating of the workpiece 4 and the polishing tool 12 is taken as the relative position D, the number of revolutions of the polishing tool 12 is taken as N, the ratio of the circumference of a circle to its diameter is taken asπ. Polishing is performed by changing the number of revolutions N of the polishing tool 12 so that the expression, 2×D×π×N = constant, may be satisfied with the change of the relative position D by oscillation of the workpiece 4 and the polishing tool 12.
申请公布号 JPH10156689(A) 申请公布日期 1998.06.16
申请号 JP19960326247 申请日期 1996.12.06
申请人 OLYMPUS OPTICAL CO LTD 发明人 YOKOYAMA SHINJI
分类号 B24B13/02;(IPC1-7):B24B13/02 主分类号 B24B13/02
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