发明名称 EPOXY RESIN COMPOSITION, EPOXY RESIN VARNISH, EPOXY RESIN PREPREG AND MULTILAYER PRINTED WIRING BOARD MADE BY USING THIS EPOXY RESIN PREPREG AS PREPREG FOR BONDING
摘要 PROBLEM TO BE SOLVED: To improve the resin flow when a large quantity of an inorginic filler such as barium titanate is blended with a resin composition comprising a blend of an epoxy resin and a phenol adduct of a diene polymer. SOLUTION: The essential components used comprise 100 pts.wt. resin component consisting of an epoxy resin, a phenol adduct of a diene polymer and a cure accelerator, 180-250 pts.wt. inorganic filler having a relative permittivity of at least 10, and a titanate coupling agent in an amount of 0.1-0.6 pt.wt. based on 100 pts.wt. of the inorganic filler. The solvent used for making the varnish comprises a mixture of at least one solvent having a boiling point of 50-90 deg.C and at least one solvent having a boiling point of 110-160 deg.C.
申请公布号 JPH10158472(A) 申请公布日期 1998.06.16
申请号 JP19960318364 申请日期 1996.11.28
申请人 HITACHI CHEM CO LTD 发明人 SUGIMURA TAKESHI;NEGISHI HARUKI
分类号 C08J5/24;B32B15/08;C08K13/02;C08L47/00;C08L63/00;C09D163/00;C09J163/00;H05K1/03;H05K3/46;(IPC1-7):C08L63/00 主分类号 C08J5/24
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