发明名称 |
EPOXY RESIN COMPOSITION, EPOXY RESIN VARNISH, EPOXY RESIN PREPREG AND MULTILAYER PRINTED WIRING BOARD MADE BY USING THIS EPOXY RESIN PREPREG AS PREPREG FOR BONDING |
摘要 |
PROBLEM TO BE SOLVED: To improve the resin flow when a large quantity of an inorginic filler such as barium titanate is blended with a resin composition comprising a blend of an epoxy resin and a phenol adduct of a diene polymer. SOLUTION: The essential components used comprise 100 pts.wt. resin component consisting of an epoxy resin, a phenol adduct of a diene polymer and a cure accelerator, 180-250 pts.wt. inorganic filler having a relative permittivity of at least 10, and a titanate coupling agent in an amount of 0.1-0.6 pt.wt. based on 100 pts.wt. of the inorganic filler. The solvent used for making the varnish comprises a mixture of at least one solvent having a boiling point of 50-90 deg.C and at least one solvent having a boiling point of 110-160 deg.C. |
申请公布号 |
JPH10158472(A) |
申请公布日期 |
1998.06.16 |
申请号 |
JP19960318364 |
申请日期 |
1996.11.28 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
SUGIMURA TAKESHI;NEGISHI HARUKI |
分类号 |
C08J5/24;B32B15/08;C08K13/02;C08L47/00;C08L63/00;C09D163/00;C09J163/00;H05K1/03;H05K3/46;(IPC1-7):C08L63/00 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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