发明名称 DEVICE FOR CONCURRENT IN-MOLD DECORATING WITH INJECTION MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a device for concurrent in-mold decorating with injection molding which is capable of sending a decorated film to a position opposite to the face of a female die and also accurately locating the pattern of the decorated film with the female die and setting the film. SOLUTION: A decorated film X is sent to the parting face of a female die 2 at a normal temperature from a roll R and is registered opposite to a cavity 2a. Further, the decorated film X is registered by fitting a film holding frame 32 into a fitting groove 2b on the parting face of the female die 2. Next, a heating platen 9 is transferred from a standby position outside the mold tool to a position opposite to the decorated film X, and the film X is pressed against the female die 2 through a rectangular holding frame 14 to be thermally softened. In addition, the film X is brought into tight contact with the inner face of the cavity 2a by an evacuation from an exhaust hole 8, and after the retreating of the heating platen 9, the mold tool is closed and a molten resin is injected into the cavity 2a through an injection gate 4 to stick the decorated film X to the surface of a molded product.
申请公布号 JPH10156876(A) 申请公布日期 1998.06.16
申请号 JP19970294628 申请日期 1997.10.27
申请人 DAINIPPON PRINTING CO LTD 发明人 ONO SHINPEI;MIYAZAWA KAZUSHI;HANAMOTO KEISHI;TARUYA TAKASHI;MATANO TAKASHI;KOBAYASHI KAZUHISA;ATAKE HIROYUKI
分类号 B29C33/14;B29C33/12;B29C33/18;B29C45/14;B29C45/16;B29C45/18;B29C45/58;B29C45/72;B29C45/73;B29C45/78;B29C51/32;B29L9/00;(IPC1-7):B29C45/14 主分类号 B29C33/14
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