| 摘要 |
<p>PROBLEM TO BE SOLVED: To enable an operator to easily take suitable measures by displaying hysteresis of a data value per measurement and detection of a cut line of a semiconductor wafer cut in a dicing device together with the allowable range in relation to the normal value in form of a diagram in time sequence. SOLUTION: In a machining state display device 10 of a dicing device, a cut line measured and detected data obtained by processing an image signal of a cut ling from a CCD camera 12 for detecting an image of the cut line of a semiconductor wafer W magnified by a microscope 11 by an image processing device 10 is input into a CPU 4 and stored in a memory 14 and the latest data for the prescribed times of the cut line measured and detected data measured and detected every time the cutting amount input and stored in the memory reach the prescribed amount, a normal value of the data of the cut line of the semiconductor wafer, and an allowable value are called and displayed on a CRT 15 in form of a diagram.</p> |
