| 发明名称 |
Semiconductor device suitable for testing |
| 摘要 |
A semiconductor device includes a rigid member embedded in a resin package body for supporting thereon outer leads that extend from the resin package body and test pads provided on the outer leads for testing the semiconductor device.
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| 申请公布号 |
US5767527(A) |
申请公布日期 |
1998.06.16 |
| 申请号 |
US19950498057 |
申请日期 |
1995.07.05 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
YONEDA, YOSHIYUKI;TSUJI, KAZUTO |
| 分类号 |
B29C45/26;C04B28/34;G01R31/28;H01L21/56;H01L21/66;H01L23/00;H01L23/495;H01L23/50;H01L23/58;(IPC1-7):H01L23/58;H01L23/28 |
主分类号 |
B29C45/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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