发明名称 Substrate processing apparatus and substrate processing method
摘要 A substrate such as a semiconductor wafer is transferred to a plurality of process chambers so as to perform prescribed processes. An inspection chamber is air-tightly connected to each of the process chambers. The inspection chamber is provided with a handler which loads and unloads the substrate. A gate valve is disposed between each process chamber and the inspection chamber. By this gate valve, each chamber is air-tightly closed.
申请公布号 US5766360(A) 申请公布日期 1998.06.16
申请号 US19930036894 申请日期 1993.03.25
申请人 KABUSHIKI KAISHA TOSHIBA;TOSHIBA KIKAI KABUSHIKI KAISHA 发明人 SATO, YUUSUKE;OHMINE, TOSHIMITSU;HONDA, TAKAAKI
分类号 C23C16/44;C23C16/52;C23C16/54;H01L21/00;(IPC1-7):C23C16/00 主分类号 C23C16/44
代理机构 代理人
主权项
地址