发明名称 |
Substrate processing apparatus and substrate processing method |
摘要 |
A substrate such as a semiconductor wafer is transferred to a plurality of process chambers so as to perform prescribed processes. An inspection chamber is air-tightly connected to each of the process chambers. The inspection chamber is provided with a handler which loads and unloads the substrate. A gate valve is disposed between each process chamber and the inspection chamber. By this gate valve, each chamber is air-tightly closed.
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申请公布号 |
US5766360(A) |
申请公布日期 |
1998.06.16 |
申请号 |
US19930036894 |
申请日期 |
1993.03.25 |
申请人 |
KABUSHIKI KAISHA TOSHIBA;TOSHIBA KIKAI KABUSHIKI KAISHA |
发明人 |
SATO, YUUSUKE;OHMINE, TOSHIMITSU;HONDA, TAKAAKI |
分类号 |
C23C16/44;C23C16/52;C23C16/54;H01L21/00;(IPC1-7):C23C16/00 |
主分类号 |
C23C16/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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