| 摘要 |
This patent discloses an analyzer that can be mounted onto a wave solder machine and passed through a solder wave to determine various characteristics associated with the solder wave to assist operators with proper set up and trouble shooting. The analyzer comprises a pallet made of a thermally insulated material. The pallet supports a housing that contains a data collector having its own power supply. The pallet further supports a coupon that is made of circuit board material so that test measurements may be made simulating actual circuit board conditions as closely as possible. The pallet can accept coupons of different circuit board types such as multi-layer or double sided. The pallet further has dissimilar wire pairs embedded therein. The wire pairs have terminal portions strategically exposed along a bottom surface of the pallet located in non-contacting, but close proximity to one another. As the dissimilar wire pairs pass through a solder wave, a thermal emf is generated that can be detected by the data collector. Based upon information sensed by the dissimilar wire pairs, the thermocouples mounted to the coupon, and a timer, the data collector is able to determine substantial physical characteristics associated with the solder wave.
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