发明名称 |
Multi-layer wiring structure |
摘要 |
A multi-layer wiring structure for mounting electronic devices is provided to be used in an electronic computer, a work station or the like, and more particularly a multi-layer packaging board having microscopic wiring layers, which board has an excellent dimensional stability and a high reliability, and also a method of producing such a board are provided. The multi-layer wiring structure includes a complex of at least two sub-assemblies each having wiring layers formed respectively on opposite sides of a core material of a low thermal expansive metal through an insulation layer in such a manner that the wiring layers correspond in area ratio to each other. The sub-assemblies are connected to one another by conductors via through holes. In this structure, the wiring structure having the core material of a low thermal expansive metal is used as a base, and therefore a dimensional change of a board is small, and microscopic wiring layers can be formed, and the reliability of connection between the sub-assemblies is enhanced. Furthermore, the board can be produced at low costs.
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申请公布号 |
US5768108(A) |
申请公布日期 |
1998.06.16 |
申请号 |
US19960720028 |
申请日期 |
1996.09.27 |
申请人 |
HITACHI, LTD. |
发明人 |
MIURA, OSAMU;MIYAZAKI, KUNIO;TAKAHASHI, AKIO;WAJIMA, MOTOYO;WATANABE, RYUJI;MIWA, TAKAO;SATSU, YUICHI;AMAGI, SHIGEO |
分类号 |
H05K1/05;H01L21/48;H01L23/538;H05K1/11;H05K3/40;H05K3/42;H05K3/46;(IPC1-7):H05K1/11;H05K1/09;H05K1/00;H05K1/16 |
主分类号 |
H05K1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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