| 摘要 |
A power distribution structure for a multichip module and a method for fabricating the same are shown. According to the method of the present invention, a base plate is provided, a plurality of mesas arranged in a pattern are formed on the base plate, the mesas having electrically conductive upper surfaces which lie substantially in a single plane. A thin, conformal dielectric layer is then formed over the exposed surfaces of the mesas and the support base and a conductive material is deposited over the dielectric material filling the area between and surrounding the mesas. The resulting structure is then planarized, as by polishing, such that the upper surfaces of the mesas and the upper surface of the conductive material surrounding the mesas lie in substantially one plane and are electrically isolated from each other by the dielectric material. A multilayered thin film structure for a multichip module may then be formed over the power distribution structure and power and ground potentials supplied to microelectronic components, such as integrated circuit chips, mounted on the surface of the thin film structure using vias routed through the thin film structure. |
