发明名称 |
EPOXIDHARZMISCHUNGEN |
摘要 |
<p>PCT No. PCT/EP94/00747 Sec. 371 Date Sep. 14, 1995 Sec. 102(e) Date Sep. 14, 1995 PCT Filed Mar. 10, 1994 PCT Pub. No. WO94/21703 PCT Pub. Date Sep. 29, 1994Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components: a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from (A) polyepoxy compounds with at least two epoxy groups per molecule and (B) phosphinic acid anhydrides and/or phosphonic acid anhydrides, and an aromatic polyamine as the hardener.</p> |
申请公布号 |
AT166660(T) |
申请公布日期 |
1998.06.15 |
申请号 |
AT19940911147T |
申请日期 |
1994.03.10 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT;HOECHST AKTIENGESELLSCHAFT |
发明人 |
GENTZKOW, WOLFGANG VON;HUBER, JUERGEN;KAPITZA, HEINRICH;ROGLER, WOLFGANG;KLEINER, HANS-JERG;WILHELM, DIETER |
分类号 |
C08J5/24;C08G59/14;C08G59/20;C08G59/40;C08G59/50;C08K5/3477;C08L63/00;C09K21/14;H05K1/03;(IPC1-7):C08G59/14 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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