发明名称 EPOXIDHARZMISCHUNGEN
摘要 <p>PCT No. PCT/EP94/00747 Sec. 371 Date Sep. 14, 1995 Sec. 102(e) Date Sep. 14, 1995 PCT Filed Mar. 10, 1994 PCT Pub. No. WO94/21703 PCT Pub. Date Sep. 29, 1994Epoxy resin mixtures for producing prepregs and composites that are available at low cost and can be processed well yield flame-retardant molding materials even without the addition of flame retardants, and these molding materials have a high glass transition temperature and also have an improved interlaminar adhesion and adhesion to copper when they contain the following components: a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, composed of structural units derived from (A) polyepoxy compounds with at least two epoxy groups per molecule and (B) phosphinic acid anhydrides and/or phosphonic acid anhydrides, and an aromatic polyamine as the hardener.</p>
申请公布号 AT166660(T) 申请公布日期 1998.06.15
申请号 AT19940911147T 申请日期 1994.03.10
申请人 SIEMENS AKTIENGESELLSCHAFT;HOECHST AKTIENGESELLSCHAFT 发明人 GENTZKOW, WOLFGANG VON;HUBER, JUERGEN;KAPITZA, HEINRICH;ROGLER, WOLFGANG;KLEINER, HANS-JERG;WILHELM, DIETER
分类号 C08J5/24;C08G59/14;C08G59/20;C08G59/40;C08G59/50;C08K5/3477;C08L63/00;C09K21/14;H05K1/03;(IPC1-7):C08G59/14 主分类号 C08J5/24
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