| 摘要 |
In many assembly applications of optical arrays, a bridging member is bonded to the arrays to hold them securely. It has been found that a pad made of layers of glass and silicon provides an efficient heat transmitting structure for this purpose. Because glass is absorbent to laser radiation at 10.6 mu m, it absorbs all the incident laser radiation, and imparts the heat generated to the silicon, which transmits it uniformly over its entire surface. The heat can then be used to melt solder or to heat-cure an adhesive, thereby affecting a robust mechanical bond in an efficient and rapid manner.
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