| 摘要 |
A cleaning process which comprises contacting a printed circuit board to which a residue of a flux is attached with a cleaning composition containing a first solvent and an organic compound, and then with a second solvent. The first solvent is an aliphatic hydrocarbon solvent having 5 to 20 carbon atoms. The organic compound is a 1-alkyl-2-pyrrolidone having 3 to 18 carbon atoms, a tri-alkylphosphine oxide having 3 to 8 carbon atoms or a di-alkylsulfoxide having 3 to 8 carbon atoms. The organic compound is in an amount of 10 to 300 g per liter of the hydrocarbon solvent. The cleaning composition does not contain a halogen compound.
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