| 摘要 |
PURPOSE:To thermally press-bond leads on a board without irregularity in pressing by pressing the leads to the board by a thermal press-bonding element, further pressing a heat transfer element to the bonding element, and thermally press-bonding the leads to the board. CONSTITUTION:A thermal press-bonding element 8 is a plate state, and a thermal press-bonding element 8a protrudes to surround a nozzle 2. A heat transfer element 9 is relatively vertically moved up or down to be separated from or brought into contact with the element 8a to transfer the heat of a heat block 3 to the element 8a. The element 8 and the element 9 are independently rotatable, and independently followed to a slope of the upper surface of a board to be rotated. |
