SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

A semiconductor integrated circuit device having a package structure, in which two kinds of chips, one chip mounted with a CPU and a flash memory and the other mounted with a DRAM are contained in a single package. This structure reduces the number of external connection terminals and the IC mounting area, and lowers the manufacturing cost. The semiconductor integrated circuit device comprises a chip (MF) mounted with a microcomputer including a CPU, a memory and peripheral circuits and a flash memory, and a chip (AD) mounted with a DRAM and a logic circuit such as an ASIC. In the connection between the chip (MF) and the other chip (AD), address terminals (A0-A10), data input/output terminals (D0-D31), a power supply terminal (Vcc), a ground terminal (Vss) and control terminals such as row address strobe terminals (RAS, column address strobe terminal CASL, CASH, CASHL, CASHH) are connected to the same external connection terminals of the single-package semiconductor integrated circuit.