发明名称
摘要 PURPOSE:To provide a means for simplifying a workpiece set and facilitating a wafer taken out in a multiwire saw. CONSTITUTION:A dummy member 20 of L-shaped section is fixed onto a base 9 mounted to a workpiece press-up base 10 of a multiwire saw of one-way running type. A work piece is loaded, so that its side surface part 6-4 is brought into contact with a side plate part 20-2, on a bottom plate part 20-1 of this L-shaped dummy member 20. At the time of cutting by a wire of running in a direction of one way, while grinding resistance acting on the workpiece is supported by the side plate part 20-2 of the dummy member, the workpiece is cut into the dummy member bottom plate part. After cutting, a wafer placed on the dummy member is taken out. In this way, setting of the workpiece to the multiwire saw is simplified. Taking out the wafer is facilitated. A rate of operation of the multiwire saw is increased. The wafer of high quality with no saw mark is obtained.
申请公布号 JP2765307(B2) 申请公布日期 1998.06.11
申请号 JP19910283520 申请日期 1991.10.03
申请人 SUMITOMO KINZOKU KOGYO KK 发明人 KOJIMA MASAYASU;KUBOKI TAKASHI
分类号 B24B27/06;B28D1/08;B28D5/04;(IPC1-7):B24B27/06 主分类号 B24B27/06
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