| 摘要 |
<p>A multilayered package in which a plurality of tape carriers where semiconductor chips are mounted are stacked. One end of each of leads formed on one side of each tape carrier is electrically connected to one of the connecting terminals of the semiconductor chips, and the other end of each of the leads are electrically connected to one of the through holes made in the carriers. The connecting terminals which are common to the semiconductor chips are formed at an area of the carriers and led to the external connecting terminals through the through holes.</p> |
