| 摘要 |
<p>PURPOSE:To provide a lead frame for a semiconductor device in which crack of a package can be prevented upon absorption of moisture of a resin film. CONSTITUTION:A resin film made of polyimide, etc., to be electrically insulated is stuck to an element support 3 of a lead frame. The frame for a semiconductor device in which a semiconductor element such as a silicon chip is mounted and sealed with plastic sealer 5, wherein the support 3 is divided, and the length of a long side of the film stuck by adhesive such as polyetheramideimide is substantially 5mm or less. Since the length or area of the film is small, absorption of moisture is reduced, crack of the sealer can be prevented, while the chip is mounted, and a wire bonding can be effectively performed. Since using amount of the film can be deleted, its cost can be reduced.</p> |
