| 摘要 |
The present invention pertains to a process for manufacturing a chip card, whereby a semiconductor chip mounted on a module (5) is mechanically and electrically connected with a recess (2) in a card holder (1), together with an inductive information transmitter (3) mounted in the chip card. According to the invention, said recess presents connecting surfaces (4) either integrated to said transmitter (3) or leading thereto. In one embodiment, the module (5) is inserted in the recess (2) with the front face turned downwards, so that the module rear face externally closes the recess (2) and its front face can touch the connecting surfaces (4) of said transmitter. In another embodiment, the semiconductor chip is located on the card holder substrate which has, at least on its lower face, contacts leading to the inductive information transmitter, with which they are interlocked in positive material fit. In the latter embodiment, the module is placed with its rear face turned forward in the recess of the card body, then soldered, possibly by thermode reflow soldering. A metallizing surface intended as a contact linkage towards the information transmitter presents an opening for receiving the brazing filler metal or the conductive glue and is used for direct heat energy supply. |
