发明名称 |
Kapazitiver Microsensor mit geringer Fremdkapazität und Herstellungsverfahren |
摘要 |
The present invention relates to a capacitive microsensor comprising a sandwich of three silicon wafers (1, 2, 3), a peripheral band of the internal face of each external wafer being bonded to a corresponding band of the opposite face of the central wafer by means of an insulating band (5, 6). The insulating band is a band of silicon oxide which partially penetrates into the outer wafers. <IMAGE> |
申请公布号 |
DE69409991(D1) |
申请公布日期 |
1998.06.10 |
申请号 |
DE1994609991 |
申请日期 |
1994.02.08 |
申请人 |
SEXTANT AVIONIQUE S.A., MEUDON LA FORET, FR |
发明人 |
LEGOUX, CHRISTOPHE, F-26000 VALENCE, FR;PRESSET, RENE, F-26800 ETOILES/RHONE, FR |
分类号 |
G01D5/241;G01L9/00;G01P15/125 |
主分类号 |
G01D5/241 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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