发明名称 Scheibenförmiger Wafer und Verfahren zu seiner Herstellung
摘要 A wafer having chamfered bent portions in the joint regions between the contour of the wafer and the cut-away portion of the wafer such as an orientation flatness. The chipping of the wafer can be prevented, and in coating the wafer with a photoresist, forming an epitaxially grown layer on the wafer, etc., films having desired characteristics can be provided on the surface of the wafer.
申请公布号 DE3326356(C3) 申请公布日期 1998.06.10
申请号 DE19833326356 申请日期 1983.07.21
申请人 HITACHI, LTD., TOKIO/TOKYO, JP 发明人 MAEJIMA, HISASHI, HIGASHIYAMATO, JP;NISHIZUKA, HIROSHI, HIGASHIKURUME, JP;KOMORIYA, SUSUMU, TOKOROZAWA, JP;EGASHIRA, ETUO, YAMANASHI, JP
分类号 H01L21/02;B24D5/02;C30B33/00;H01L21/304;H01L23/544;H01L29/06;(IPC1-7):H01L21/304 主分类号 H01L21/02
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