| 摘要 |
A lead frame structure and semiconductor package using the same and fabrication method thereof is provided that decreases noise by providing prescribed impedances for leads of a lead frame. The lead frame structure for the semiconductor package includes a paddle, a plurality of leads regularly aligned outside the paddle, and upper and lower dielectric adhesive layers sandwiching the plurality of leads. Upper and lower dielectric layers are attached on an upper surface of the upper dielectric adhesive layer and a lower surface of the lower dielectric adhesive layer. Upper and lower metallic polar plates formed on an upper surface of the upper dielectric layer and a lower surface of the lower dielectric layer. The lead frame structure for the semiconductor package decreases noises such as electromagnetic noise, reflection noise and delta-I noise by appropriately providing characteristic impedances for selected leads applicable to signal lines and at the same time decreasing characteristic impedances for the selected leads applicable to power lines or ground lines. |
