| 摘要 |
<p>A liquid epoxy resin potting material is described utilizing (A) a liquid epoxy resin, (B) a liquid alkylated diaminodiphenylmethane, (C) an epoxidized polybutadiene, and (D) an inorganic filler, wherein the ratios of the individual components in weight ratios are: <MATH> <MATH> and <MATH></p> |
