| 摘要 |
PROBLEM TO BE SOLVED: To provide small-sized electronic part which has a structure in which a through hole for degassing is sealed by a sealing valve provided on a support substrate from the inside of a cavity, prevents the reduction of the degree of vacuum of the cavity by performing the main joining of the support substrate and a sealing substrate and the seal joining of the through hole by two time anode joining, and can reduce its size further and a manufacturing method thereof. SOLUTION: This electronic part is constituted in such a manner that a support substrate 1 having a function part 3 and a sealing valve 2 having a cantilever structure and a sealing substrate 11 having a through hole 11b are joined and cavity 12 which stores the function part 3 is formed. The through hole 11b formed on the sealing substrate 11 is sealed by the sealing valve 2 formed on the support substrate 1 from its inside to seal the cavity 12. |
