| 摘要 |
PROBLEM TO BE SOLVED: To thin an IC card and to manufacture the card in a mass production by opening a container at a core sheet containing an assembly such as an IC and a capacitor, incorporating an assembly sheet therein, and then adhering a cover sheet by ultrasonic bonding. SOLUTION: An assembly 2 of an IC and a capacitor is stored in a storage unit of an assembly sheet 5, and a container is opened at a core sheet 6 for containing the sheet 5. The sheet 5 is contained in the container, and an inner wall of the container is adhered to an outer peripheral end of the sheet 5 to be sealed by using a sealer. Cover sheets 8, 9 are adhered to front and back surfaces of the sheet 6 by interposing an ultrasonic bonding melting material 10 between the sheets 8, 9 and 6, bonded by ultrasonic bonding to constitute the non-contact type IC card. The corresponding surface of the material 10 to the sheet 5 is not adhered as a cutout part 10a. |
