| 摘要 |
PROBLEM TO BE SOLVED: To obtain a required space on the surface of a chip type device (particularly, a surface acoustic wave device) when the device is mounted on a substrate. SOLUTION: On a substrate 3, a land 5 for mounting a chip type device (hereinafter called 'device') 1, a recessed section 9 which becomes the supplying port of a resin 2, and a cavity 10 which becomes a space when the device 1 is sealed with the resin 2 are formed. The depth of the recessed section 9 is adjusted so that the depth of the surface of the device 1 from the upper surface of the substrate 3 can fall within the range of±several tens etμm when the device 1 is mounted on the land 5 of the substrate 3 and, after the device 1 is mounted on the land 5, the resin 2 is supplied and seals bumps 5, the land 5, and electrode pads 6. The cavity 10 is formed to nearly the same depth as that of the recessed section 9 and walls 11 make the quantity of the resin 2 accumulated in the recessed section 9 constant. When the quantity of the supplied resin 2 exceeds a fixed quantity, the excessive quantity of resin 2 flows in the cavity 10 through the gap between the walls 11 and device 1. Since the walls 11 control the flowing-in of the resin 2, the cavity 10 becomes the storing pool of the resin 2 and the space of the device 1.
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