发明名称 System and a method for mounting electronic components
摘要 A system and a method for mounting electronic components on a printed circuit board are disclosed. The system comprises a component supporting stage, a board bearing stage, mounting heads, vacuum bits, pressure sensors, device for computing thresholds, and device for determining the status of the pick-up operation of the vacuum bits. The method comprises the steps of detecting a first pressure value of a vacuum bit at which the vacuum bit is open and a second pressure value of the vacuum bit at which the vacuum bit is closed, computing a threshold value in response to the detected first and second pressure values, and moving the mounting heads to the board bearing stage in response to a determination that the pressure value of the vacuum bit at which the component is picked up exceeds the threshold values.
申请公布号 US5761798(A) 申请公布日期 1998.06.09
申请号 US19960603127 申请日期 1996.02.20
申请人 SAMSUNG AEROSPACE INDUSTRIES, LTD. 发明人 SUZUKI, NAOKI
分类号 B23P21/00;B23Q7/00;B23Q7/04;H05K13/04;(IPC1-7):B23P19/00;H05K3/30 主分类号 B23P21/00
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