发明名称 Semiconductor element cooling apparatus
摘要 A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.
申请公布号 US5763950(A) 申请公布日期 1998.06.09
申请号 US19960598331 申请日期 1996.02.08
申请人 FUJITSU LIMITED 发明人 FUJISAKI, AKIHIKO;ISHIMINE, JUNICHI;SUZUKI, MASUMI;MIYO, MASAHIRO;KIKUCHI, SHUNICHI;HIRANO, MINORU;NORI, HITOSHI
分类号 H01L23/36;H01L23/367;H01L23/433;H01L23/467;H01L23/473;H01L29/06;(IPC1-7):H01L23/34 主分类号 H01L23/36
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