发明名称 |
Semiconductor element cooling apparatus |
摘要 |
A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.
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申请公布号 |
US5763950(A) |
申请公布日期 |
1998.06.09 |
申请号 |
US19960598331 |
申请日期 |
1996.02.08 |
申请人 |
FUJITSU LIMITED |
发明人 |
FUJISAKI, AKIHIKO;ISHIMINE, JUNICHI;SUZUKI, MASUMI;MIYO, MASAHIRO;KIKUCHI, SHUNICHI;HIRANO, MINORU;NORI, HITOSHI |
分类号 |
H01L23/36;H01L23/367;H01L23/433;H01L23/467;H01L23/473;H01L29/06;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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