Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe

摘要

A high-reliability semiconductor device and a method of producing the device. Absorption of moisture into a semiconductor device is effectively avoided by using a hard solder material, such as common solder having no moisture absorption, for die-bonding a semiconductor chip to a die pad. Thus, in the semiconductor device in accordance with the present inventions there are no corrosion problems nor package-cracking due to absorbed moisture.