发明名称 |
System for real-time control of semiconductor wafer polishing including heater |
摘要 |
A system for polishing a semiconductor wafer, the system comprising a platen subassembly defining a polishing area; a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and means for heating the wafer while the wafer face is being polished.
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申请公布号 |
US5762537(A) |
申请公布日期 |
1998.06.09 |
申请号 |
US19970821936 |
申请日期 |
1997.03.21 |
申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
SANDHU, GURTEJ S.;DOAN, TRUNG TRI |
分类号 |
B23Q15/013;B23Q15/12;B24B13/015;B24B37/04;B24B49/02;B24B49/04;B24B49/10;B24B49/12;B24B49/14;B24B57/02;G05B19/404;(IPC1-7):B24B29/00 |
主分类号 |
B23Q15/013 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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