发明名称 COMPACT ELECTRONIC PART AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To miniaturize a part, simplify a sealing structure, and improve sealing reliability by providing a through hole for degassing at a cavity which accommodates a functional part and forming the functional part and a sealing structure in upper and lower directions. SOLUTION: A functional part 1a is formed on a support substrate 1, and a substrate 2 to be covered where a through hole 2b for degassing is provided is joined to the support substrate 1, thus forming a cavity 2c. Then, a sealing substrate 3 is joined to the substrate 2 to be covered and the through hole 2b is sealed by a sealing valve 3b. Since the through hole 2b for degassing is formed at the cavity 2c for accommodating a functional part 1c in this manner, the through hole 2b (sealing structure) and the functional part 1c are located up and down in vertical structure, thus miniaturizing a part. Also, since the pressure of the through hole 2b for degassing is reduced for sealing externally by the sealing valve 3b, a sealing structure is simplified and atmospheric pressure presses the sealing valve 3b externally, thus improving a sealing reliability.
申请公布号 JPH10153617(A) 申请公布日期 1998.06.09
申请号 JP19960311956 申请日期 1996.11.22
申请人 MURATA MFG CO LTD 发明人 YANO TATSUFUMI
分类号 G01L1/10;G01P15/08;G01P15/125;H01L29/84 主分类号 G01L1/10
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