发明名称 WORKING METHOD OF MOLD FOR RESIN SEAL MOLDING FOR ELECTRONIC PARTS AND MOLD
摘要 PROBLEM TO BE SOLVED: To improve the releasability of a molded body and prevent resin drosses from adhering onto a cavity surface by a method wherein the surface, which comes into contact with molten resin material, of a mold surface is formed into a smooth surface so as to produce a satin-finished surface having no undercut part on the mold surface by blasting rigid granular materials against the smooth surface. SOLUTION: A smooth surface 21 is formed on a mold cavity surface so as to blast rigid granular materials 22 made of super-hard metal material, ceramic or the like against the smooth surface 21. Further, on the mold cavity surface 30, a satin-finished surface having no undercut part is formed. As a result, the releasability of a resin seal molded body molded in a mold cavity can be improved. Furthermore, resin drosses can be efficiently prevented from adhering onto the mold cavity surface 30 after the resin seal molded body is separated from a mold. As the rigid granular material 22, an ellipsoidal body or a body having a polygonal section may well be employed.
申请公布号 JPH10151633(A) 申请公布日期 1998.06.09
申请号 JP19960326018 申请日期 1996.11.20
申请人 TOWA KK 发明人 OSADA MICHIO
分类号 B29C33/38;B29C45/02;B29C45/14;B29C45/26;B29C45/37;B29L31/34;H01L21/56;(IPC1-7):B29C33/38 主分类号 B29C33/38
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