发明名称 Non-cyanide brass plating bath and a method of making metallic foil having a brass layer using the non-cyanide brass plating bath
摘要 The present invention provides a non-cyanide brass plating bath composition containing copper, zinc, metal polyphosphate, and orthophosphate, with the proviso that the composition does not contain cyanide. The present invention also provides a method of making metallic foil having a brass layer including the steps of providing a metallic foil; contacting the metallic foil with a non-cyanide brass plating bath containing copper, zinc, metal polyphosphate, and orthophosphate, with the proviso that the brass plating bath does not contain cyanide; applying a current to the brass plating bath; and recovering the metallic foil having a brass layer.
申请公布号 US5762778(A) 申请公布日期 1998.06.09
申请号 US19970866400 申请日期 1997.05.30
申请人 GOULD ELECTRONICS INC. 发明人 AMEEN, THOMAS J.;ORLOFF, GREGORY L.
分类号 C25D3/56;C25D3/58;H05K3/00;H05K3/38;(IPC1-7):C25D3/58;B05B3/10;B22F7/00 主分类号 C25D3/56
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