Thermoplastic resin composition and molded product thereof

摘要

The thermoplastic resin composition of the present invention comprises (A) polyamide having a melting point of not lower than 280 DEG C., particularly preferably (A-1) specific polyamide having a melting point of higher than 300 DEG C., (B) a specific modified polymer, (C) a hindered phenol type antioxidant having a molecular weight of not less than 500 and a TGA 10% weight loss temperature of not lower than 300 DEG C., and (D) a sulfur type antioxidant having a molecular weight of not less than 600 and a TGA 10% weight loss temperature of not lower than 280 DEG C. The molded product of the present invention is made of the above-mentioned thermoplastic resin composition. The thermoplastic resin composition of the invention is excellent in heat stability.