发明名称 LIGHT EMITTING DEVICE AND METHOD FOR MOLDING IT
摘要 PROBLEM TO BE SOLVED: To stabilize light emitting characteristics regardless of environment for use and to improve light utilization efficiency and yield by forming a light taking-out part side and an electric connection part side by separating respectively their functions to an LED chip. SOLUTION: A silver-plated copper plate being an outer electrode 105 is embedded in a light-transmitting supporting body 101 in which a lens part is integrally molded by transfer molding. In addition, on the light-transmitting supporting body 101 being on opposite side to the lens part, a recessed part on which an LED chip 102 is arranged is formed and a recessed part in which the bottom side is projected outward is provided in the recessed part. In addition, the LED chip 102 is die-bonded in the recessed part by using a light- transmitting adhesive 104 so as to make the optical axis coincide with the lens part of the light-transmitting supporting body 101. After the die-bonding resin is cured, the outer electrode 105 exposed in the recessed part from the light-transmitting supporting body 101 and an electrode of the LED chip 102 with a gallium nitride compd. semi-conductor on a sapphire base are wire-bonded with an electrically conductive wire 103.
申请公布号 JPH10151794(A) 申请公布日期 1998.06.09
申请号 JP19960311604 申请日期 1996.11.22
申请人 NICHIA CHEM IND LTD 发明人 YAMADA GENRIYOU
分类号 B41J2/44;B41J2/45;B41J2/455;H01L33/06;H01L33/28;H01L33/32;H01L33/34;H01L33/42;H01L33/50;H01L33/52;H01L33/58;H01L33/62 主分类号 B41J2/44
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