| 摘要 |
<p>PROBLEM TO BE SOLVED: To uniform the coating film thickness of a semiconductor wafer sup port face of a boat support by chamfering the edge of the semiconductor wafer support face of the boat support. SOLUTION: A coating film is accumulated thin over the whole inner surface of a boat at the beginning of coating and accumulated thick all over with the lapse of time, but if the edge of a support face 2 of a groove 3 of a boat support 1 is previously chamfered, a coating flows downward along a chamfered face 6 so as not to be accumulated in a swollen state, and a semiconductor wafer support face 2 becomes flat. Since a semiconductor wafer 8 is supported by a flat contact face, stress is not concentrated on that part, and a defect such as the generation of a slip to a grain boundary is not generated even at high temperature.</p> |
