Method of forming plugs in vias of a circuit board by utilizing a porous membrane
摘要
A conductive plug is formed in drilled-through vias of a printed circuit board of a polymer ink composition by a method of flooding the vias of a printed circuit board having parchment paper attached to an underside while the printed circuit board is on a vacuum table to form a first layer of the conductive plug within the vias. A second layer of the conductive plug within the via is formed by placing a stencil over the circuit board and flooding the holes of the stencil in order to form a second layer of the conductive plug within the vias of the printed circuit board.
申请公布号
US5761803(A)
申请公布日期
1998.06.09
申请号
US19960673173
申请日期
1996.06.26
申请人
ST. JOHN, FRANK;RODRIGUEZ, FELIX;CHRISTENSEN, SUSAN
发明人
ST. JOHN, FRANK;RODRIGUEZ, FELIX;CHRISTENSEN, SUSAN