| 摘要 |
PROBLEM TO BE SOLVED: To reduce foreign materials dropped onto a wafer surface and sticking thereto at the time of etching such as carbon grains and provide an electrode plate usable for a long period by forming a small through-hole in a resin molding product having a Shore hardness within a specific range, then carrying out the carbonization and high-temperature treatment in a nonoxoidizing atmosphere and regulating the pore diameter in a glassy carbon to a specified value or below. SOLUTION: A resin molding product having 60-110, preferably 70-100 Shore hardness is used and the pore diameter in a glassy carbon is regulated to <=100μm. When the Shore hardness is <60, a deteriorated layer is produced with the frictional heat of a drill when forming a small through-hole and selectively damaged with a plasma at the time of etching to cause the dropping of carbon grains, etc. When the Shore hardness exceeds 110, the drill is severely damaged and, e.g. a machined surface is plucked off to cause flaws. The damaged surface is selectively damaged with the plasma. A furan resin, a phenol resin, an unsaturated polyester resin, etc., are used as the starting raw material for obtaining the resin molding. |
